Qualcomm in race of AR/VR. Future is AR and VR
Snapdragon® AR2 Gen 1, Qualcomm® S5 Gen 2 and S3 Gen 2 | Next Gen of Headworn AR and Immersive AudioAR is now more intuitive, interactive, and immersive than ever thanks to the Snapdragon AR2 Gen 1. With improved hand, eye, and motion tracking, the platform pushes the limits of augmented reality so you may explore the virtual world like never before. Additionally, these advanced AR experiences allow for glasses that are sleeker, compact, and lightweight, showcasing that amazing things can indeed come in tiny packaging.
The Qualcomm® S5 Gen 2 and S3 Gen 2 Sound Platforms, as well as the Snapdragon® AR2 Gen 1 Platform, were revealed at Snapdragon Summit. The Qualcomm S5 Gen 2 and S3 Gen 2 Sound Platforms establish a new premium standard for immersive audio in AR, gaming, music streaming, and more. AR2 promises to level up the way you work, play, and create in the Metaverse and beyond with unparalleled connectivity, power, and performance.
The Qualcomm S5 Gen 2 and S3 Gen 2 Sound Platforms are our most powerful audio platforms to yet. They are made to provide the most desired features for today’s music fans while still working at very low power consumption for all-day usage. The Qualcomm S5 Gen 2 and S3 Gen 2 Sound Platforms allow stereo headsets for the first time featuring lossless audio and dynamic head tracking for premium quality audio in high-end and mid-range devices.
Snapdragon AR2 Gen 1 Platform: Full Features
Distributed processing architecture
Distributes processing between a host device, such as a laptop or smartphone, and AR glasses. Using an AR processor and a co-processor that can handle latency-sensitive computing, it also distributes computation within the glasses.
Power-optimized
With Main Processor and co-processor, a reproduction engine tailored for AR displays contributes to lower the processing power by 50%.
Immersive tracking and security
Supports up to nine concurrent cameras. On-glass processing of eye tracking, and iris authentication enable new interactions and levels of security.
AI capabilities
A specially developed visual analytics engine, as well as an improved Qualcomm Spectra ISP and Qualcomm Hexagon CPU, are all included in the Snapdragon AR2 processor. Together, these contribute to a 2.5x acceleration of AI-intensive operations including image recognition, reclassification, and hand tracking, ensuring rich and immersive AR experiences.
Connectivity
Features Wi-Fi 7 connectivity with the Qualcomm® FastConnect™ 7800 mobile connectivity system with <2ms sustained latency, 40% lower power2 and support for High Band Simultaneous Multi-link. Optimized for AR experiences even in congested environments.
Sleek Design
Enables OEMs to create glasses that are high performance, comfortable and much sleeker. The smaller AR processor and multi-chip architecture help to achieve a 40% smaller PCB and 45% less wires.
Learn more about Snapdragon AR2 Gen 1 Platform
Qualcomm S5 Gen 2 Sound Platform
Top Features
- Extremely low-power performance
- Bluetooth 5.3
- Designed to support Bluetooth LE Audio including Auracast, Unicast, Broadcast, and Gaming.
- Supports a wide range of form factors including ultra-small earbuds, stereo headsets and speakers.
- Powerful quad-core processor architecture – supporting complex use cases
- Dual core 32-bit processor application subsystem (up to 80MHz)
- Dual core 240Mhz programmable Qualcomm® Kalimba™ DSP audio subsystem (runs from ROM)
- Qualcomm TrueWireless™ Mirroring technology for improved robustness and a superior user experience including dynamic role swap.
- Designed to support wake-word and/or button activated digital assistants including Amazon Alexa Voice Service and Google Assistant
- Support for Google Fast Pair and Microsoft Swift Pair
- Software architecture compatible with Qualcomm® QCC512x, Qualcomm® QCC514x, Qualcomm® QCC515x and Qualcomm® QCC517x series
- Embedded ROM + RAM and external Q-SPI Flash
- On-chip memory for audio buffering
- High-performance audio combined with low-power consumption and designed for Snapdragon Sound:
- aptX Voice technology superior for call quality on uplink and downlink
- 24bit/96kHz high resolution audio
- Lossless audio quality at up to 48KHz with Snapdragon Sound
- Support for up to 3-mic cVc
- Support for Qualcomm ANC – feedforward, feedback, hybrid and adaptive
- Support for full bandwidth natural sounding transparency
- Support for 3rd party innovation via the Qualcomm® Voice and Music Extension Program
Specs
| CPU | Clock Speed: Up to 80 MHz |
| CPU Architecture | 32-bit |
| CPU Features | Programmable Apps |
| DSP | RAM: 384kB (P) + 1408kB (D) |
| DSP Technology | 1x Qualcomm® Kalimba™ DSP, Programmable DSP |
| DSP Clock Speed | 2x 240 MHz |
| Bluetooth Version | Bluetooth 5.3 |
| Bluetooth Features | QC TrueWireless™ Mirroring technology, LE Audio Features |
| Connectivity | Bluetooth Low Energy, Dual-mode Bluetooth |
| BT Data Rate | 1 Mbps BR, 2 Mbps EDR, 3 Mbps EDR, 1 Mbps LE, 2 Mbps LE |
| Voice Services | Always on voice wake-word support, Button press |
| Voice Services Ecosystem | Amazon Alexa Voice Service, Google Assistant |
| Audio | Qualcomm® aptX™ Audio, Qualcomm® aptX™ Voice, Qualcomm® aptX™ Adaptive, Qualcomm® aptX™ Lossless Qualcomm® Active Noise Cancellation (ANC) technology: Adaptive, Feedback, Feedforward, Hybrid Qualcomm® cVc™ Echo Cancelling and Noise Suppression (ECNS) technology: up to 3-mic Earbuds, Up to 2-mic Stereo Headset, 1-mic Speaker |
| Power Consumption | ~4 mA |
| Memory Type | External Flash |
| Supported Interfaces | 24-bit audio interfaces |
| Input/Output | Audio I/O: 1x USB interface supports up to 12Mbps |
| Analog Microphone | 4-ch high quality ADCs |
| Audio Playback Interfaces | Playback DAC: Stereo DAC Channel output: Stereo 2-ch high quality Class-AB, 2-ch high quality Class-D, 3x 24-bit SPDIF up to 192 kHz |
| Audio Recording Interfaces | Recording Sampling: Up to 192kHz/24bit |
Learn more about Qualcomm S5 Gen 2 Sound Platform
Qualcomm S3 Gen 2 Sound Platform
Specs and Features
| CPU Clock Speed | Up to 80 MHz |
| CPU Architecture | 32-bit |
| CPU Features | Programmable Apps CPU |
| Bluetooth Version | Bluetooth 5.3 |
| Bluetooth Features | Qualcomm TrueWireless™ Mirroring technology |
| Connection Technology | Bluetooth Low Energy, Dual-mode Bluetooth |
| Bluetooth Data Rate | 3 Mbps EDR, 2 Mbps EDR, 1 Mbps BR |
| Voice Services | Button press, always on voice wake-word support |
| Voice Services Ecosystems | Amazon Alexa Voice Service, Google Assistant |
| Audio | Qualcomm® aptX™ Audio, Qualcomm® aptX™ Voice, Qualcomm® aptX™ Adaptive, Qualcomm® aptX™ Lossless Snapdragon Sound Technology Qualcomm® Active Noise Cancellation (ANC) technology: Adaptive, Feedback, Feedforward, Hybrid Qualcomm® cVc™ Echo Cancelling and Noise Suppression (ECNS) technology: up to 3-mic Earbuds |
| Memory Type | External Flash |
| Supported Interfaces | 24-bit audio interfaces |
| Audio Playback Interfaces | Channel output: Mono |
| Audio outputs | 1 ch high quality Class-AB, 1-ch high quality Class-D |
| Power Consumption | ~4 mA |
| DSP RAM | 384kB ( P ) + 1024kB ( D ) |
| DSP Technology | 1x Configurable DSP |
| Analog Microphone | 4-ch high quality ADCs |
